The famous Youtuber JerryRigEverything has just released a new video in which he dismantles the latest gaming phone from ASUS, the ROG Phone 3.
From the teardown we discover that the smartphone adopts an outlet to let the hot air out of the glass back cover; along with a net to keep dust out. This vent sits squarely above a fairly thick metal panel that absorbs heat from the chipset through a layer of thermal paste.
Another interesting element is the small board that powers the RGB LEDs on the back. While later in the video it turns out that under the motherboard is the large vapor chamber for heat dissipation; probably one of the largest ever seen on a smartphone.
We quickly recall that the ASUS ROG Phone 3 is equipped with the new Qualcomm Snapdragon 865 Plus chipset supported by a minimum of 12 GB of RAM and a maximum of 16 GB, while the storage space starts at 128 GB and goes up to 512 GB . In both cases it is LPDDR5 and UFS 3.1 RAM memory.
Then we find 6,6 ″ AMOLED with a 144 Hz refresh rate and 25 ms touch latency (270 Hz touch sampling rate).
Finally we have a 6.000 mAh battery that supports 30W fast charging via USB Power Delivery and three cameras on the back with resolutions of 64MP for the main, 13MP with ultra wide lens and 5MP for the macro. In front we find instead a single 24MP camera.
