Today, well-known blogger Digital Chat Station stated that: “I mentioned earlier that Honor is also working with the MediaTek Dimensity 9000 chip, but products with this chip will come in the future. The CPU for flagship will be the Snapdragon 8 Gen1 and the release is scheduled for January. It will be the first folding screen smartphone based on the Snapdragon 8 Gen1 platform and should cost less than 10000 yuan (1300 €).
The foldable in Honor coming in January with Snapdragon 8 Gen 1
So the first folding screen phone in Honor's history will be equipped with the new Snapdragon 8 Gen1 and also the first on the market with it.
Earlier this year, there were rumors about Honor's folding screen device and a person familiar with the matter had revealed that the device's name may be "Magic X".
Also, a few months ago, Digital Chat Station revealed some of the parameters of the Magic X. It revealed that the smartphone will adopt a dual screen design. The internal foldable primary screen will be 8 inches, while the external secondary screen is 6,5 inches. The supplier is BOE and is still testing UTG Ultra Thin Flexible Glass Cover.
From the point of view of the screen parameters, Honor Magic X will adopt a similar design to the previous Huawei Mate X series. It will use a left-right folding design and will be equipped with a secondary screen on the back to achieve more convenient operation. So as to avoid opening the folding screen every time and effectively improve autonomy.
