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This afternoon blogger Wisdom Pikachu revealed on Weibo (the Chinese Twitter) that the Redmi brand has started working on its next flagship with the MediaTek Dimensity 9200 chip on board. The new smartphone should be unveiled within the first half of this year .
Redmi working on its next flagship with Dimensity 9200: arriving by Q2 2023
As some of you may know, the Dimensity 9200 is MediaTek's most powerful 5G chip currently on the market, in fact it is called the "King of Dimensity" in China.
This chip comes with TSMC's second-generation 4nm manufacturing process and is equipped with an octa-core CPU, whose power consumption at peak usage has been reduced by 25% compared to the previous generation. At the same time, the chip adopts a new generation of GPU, the Arm Immortalis-G715 with 11 cores, with the performance being 32% higher than the previous generation. While regarding the CPU performance, the single core performance is 12% higher and the multi core performance is 10% higher than what the MediaTek Dimensity 9000 did.
In terms of specifications, the Dimension 9200 is composed of a super-large Arm Cortex X3 core clocked at 3,05 GHz, three large-core Cortex A715 clocked at 2,85 GHz, and four small-core Cortex A510 clocked at a clock of 1,8 GHz. The chip manages to obtain a score of AnTuTu (known benchmarking platform) that exceeds 1,2 million points.
In addition to being equipped with the MediaTek Dimensity 9200 processor, another strong point of Redmi's new flagship will be the price. Redmi has always insisted on “high quality and performance at extreme cost”, so Redmi's new device equipped with Dimension 9200 chip will be a flagship product with performance at a very competitive price. We just have to wait and find out what it is.