The Redmi brand has just officially announced that it will hold the Redmi K50 series launch conference on March 17th. So in exactly a week, we will see the K50 series equipped with Dimensity 9000 and Dimensity 8100 chips.
Redmi K50 series: presentation date confirmed
As happens before each presentation, with the approach of the press conference the brand also started releasing teasers. In particular, this morning Redmi unveiled the real benchmark for the “Genshin Impact” game on the K50 series. Official data shows that 59 fps is reached, which is very close to the maximum values, while the temperature of the K50 series is 46 ° C after an hour of testing, so just fine.
The brand said: "The high performance of Dimensity, the 'ice' cooling of the K50, together with the different adjustments tailored by the project's R&D team have created a new record."
As we all know, “Yuanshen” has become a testing tool for smartphone performance. This game has high performance requirements and at the same time tests the ability of manufacturers to tune the chip and heat dissipation performance.
In any case, also this morning, the general manager of Redmi, Lu Weibing, said that the chip MediaTek Dimensity 9000 is "the peak at the debut" and meets all expectations in terms of performance and power consumption.
It is reported that MediaTek Dimensity 9000 adopts TSMC's 4nm manufacturing process and consists of 1 Cortex-X2 super core, 3 Cortex-A710 big core and 4 Cortex-A510 small core. While the GPU is an ARM Mali-G710 and the chip can score over 1 million points on AnTuTu.
Recall that, according to previous rumors, the model equipped with the MediaTek Dimensity 9000 chip is the Redmi K50 Pro +, the Redmi K50 Pro is equipped with the Dimensity 8100 chip and the Redmi K50 is equipped with the Qualcomm Snapdragon 870 chip.
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