After the launch of the models K70E, K70 and K70 Pro at the end of November, we eagerly await the arrival of the missing model, the Redmi K70 Ultra, the super flagship of the sub brand of Xiaomi.
The specifications of the next Redmi K70 Ultra have been leaked
In this regard, the well-known Chinese blogger Digital Chat Station revealed that Xiaomi is testing a new Dimensity 9300 processor in one of its Redmi devices. This move is interpreted as an attempt by Xiaomi to diversify its hardware offering, overcoming some limitations found in Snapdragon models, in particular regarding imaging speed and battery charging. Although the exact model has not been specified, the technical characteristics suggest that it could be the long-awaited one Redmi K70 Ultra.
To give an idea of the potential of this new addition to the Redmi family, we can refer to the Redmi K70 Pro. This device is equipped with a Snapdragon 8 Gen 3 processor, LPDDR5X memory and UFS 4.0 flash memory. The device runs on the HyperOS operating system and sports an excellent 2-inch 6.67K screen with 3200*1440 resolution, peak brightness of 4000nit, and supports a maximum refresh rate of 120Hz and a high-frequency PWM modulation of 3840Hz.
La 5000mAh battery of the Redmi K70 Pro is supported by the Surge P2 fast charging chip and the Surge G1 battery management chip, which together enable 120W fast wired charging. On the back, the device is equipped with a 800-megapixel Light Hunter 50 main camera, a 2-megapixel 50x portrait lens and a 12-megapixel ultra-wide lens, While the front camera is 16 megapixels for high definition portraits.
We should also find many of these specifications on board the next Redmi K70 Ultra, with the main difference that the device will be powered by MediaTek's Dimensity 9300 processor.
Recall that the Dimensity 9300 was presented by MediaTek as the Most powerful smartphone SoC, even surpassing the Snapdragon 8 Gen 3 and A17 Pro. The chip has a maximum frequency of 3,25 GHz for the Cortex-X4 core, the fastest ever made by ARM. Furthermore, the chip is manufactured using TSMC's N4P process, which should ensure high power efficiency.
