Yesterday Xiaomi finally presented the long-awaited Xiaomi Mi 11, the world's first smartphone with Qualcomm's new Snapdragon 888 chipset. But the smartphone integrates a lot of other really interesting hardware; let's find out in the first teardown!
Xiaomi Mi 11: the first teardown shows us the internal components of a true flagship
According to the reaction of the Chinese video blogger, in terms of materials used inside and design, the Xiaomi 11 is a truly "mature" smartphone. The arrangement of the components is exceptionally precise, confirming once again what are the standards that a flagship smartphone should aim for. Also there are some special details that have been done with care.
For example, the Snapdragon 888 chipset and flash memory have a sealing glue treatment, which can improve the protection of the smartphone when it falls into the water.
In any case, as we can see in the video above, the Chinese video blogger begins the dismantling of the Xiaomi Mi 11 with the removal of the back cover. Showing the differences between the glossy one in frosted glass in the blue color and the one in soft purple leather.
Once the cover is removed, we immediately notice the presence of the wireless charging coil. This allows us to recharge the smartphone with a maximum power of 50W (from zero to 100% in 53 minutes), therefore almost at the same level as cable charging which instead reaches 55W. The coil also serves to charge other low-power devices such as TWS headphones to a maximum of 10W
While from the point of view of the cameras, the smartphone adopts a Samsung HMX sensor for the main one, an OV13B10 sensor for the ultra wide camera and a Samsung S5K5E9 sensor to take macro photos. The selfies will instead be produced by a lens with a Samsung S5K3T2 sensor inside. So the Mi 11 uses no Sony-made sensor and has the glass cover of the main camera lens with the same integrated CNC processing technology as the iPhone. The macro lens instead sees the use of an additional lens, making the processor relatively more difficult.
Also on the back of the smartphone, under the body, we find the cooling system for the dissipation of heat completely with a VC type heatsink, to which copper, graphite, silica gel and airgel sheets are superimposed; pretty much everything that can be used to cool the smartphone has been added.
After removing these components for heat dissipation, the temperature of the Snapdragon 888 can easily reach a temperature of around 80 degrees; we can say that the cooling system works very well.
In general, in the opinion of the Chinese blogger, the new Xiaomi Mi 11 was built as a premium flagship. So in addition to the exceptional specifications, we can also remain calm from the point of view of build quality.
However, we remember some of the main features of the new top of the Xiaomi range starting from the huge 6.81-inch diagonal display, 2K resolution and 120Hz refresh rate. The much talked about Snapdragon 888 is paired with up to 12GB of ultra-fast LPDDR5 RAM and up to 256GB of UFS 3.1 internal memory.
Aside from the cameras and fast charging (55W via cable, 50W with wireless charging) already mentioned above, the Xiaomi Mi 11 also adopts an audio system produced in collaboration with Harman Kardon to "create the most powerful stereo sound effect on one smartphone ”an ultra thin body with a thickness of only 8,06mm inside which we find a 4600mAh battery for a weight that settles at 196 grams.
Finally, to make everything more interesting we have the price that in China starts at only 3999 yuan, about 500 €, and includes a GaN charger with a power of 55W.
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