The Xiaomi Mi 9 presented in Barcelona last week is probably one of the smartphones received most positively by many fans of the Chinese brand. This is mainly due to the incredible specific price ratio, as well as the modern design with ultra-thin edges and rear cameras with nothing to send compared to the flagship of the most famous brands.
Since the 9 Mi has been around for quite a few days, it has already reached the device's teardown. The images you will see later are official and arrive directly from the CEO of Xiaomi, Lei Jun.
Xiaomi Mi 9: Xiaomi's boss shares the device's teardown
The teardown begins, as always, with the removal of the back cover, in this case in blue color. Under it we can already admire the coil for wireless charging that, as some of you will know, comes up to a power of well 20W, for a full charge in only 90 minutes.
This is done by removing the insulating material above the motherboard located to the right of the three rear cameras. On the motherboard we find the different components: Qualcomm Qualcomm SMB1390, Qualcomm PM855 that administers the energy, Qorvo QM56023 for power amplifier, Qualcomm WCN3998 that serves to make the WiFi and Bluetooth chip work, finally we have an IDT P9382A chip.
On the other side of the motherboard we find the powerful Qualcomm Snapdragon 855, the internal memory Samsung UFS 2.1 and the SK memory Hynix LPDDR4, along with several chips for NFC, WiFi and Bluetooth.
Instead, regarding the three cameras mentioned above. We have in succession (from top to bottom), the ultra-wide angle camera from 16MP with SONY IMX481 sensor and f / 2.2 aperture, the main from 48MP with sensor from 1 / 2 inch SONY IMX586 and aperture f / 1.75, finally there is the 2x optical zoom telephoto camera that uses a sensor from 12MP Samsung S5K3M5 with f / 2.2 aperture.
In the following image we can then see the new SLS 1217 speaker with its increased depth for more powerful audio and deeper bass. Then we have the USB Type-C connector with a plastic sheath to prevent the ingress of dust, as well as the Cirrus Logic chip used to amplify the power of the audio.
Finally, Lin Bin shows us the new fingerprint sensor under the fifth generation screen. This is able to unlock the device up to 25% faster than previous generations, working even at lower temperatures and in places with lots of light.
We must say that even inside the Xiaomi Mi 9 is quite fascinating. What do you think about it? Do you agree with us? Please let us know in the comments section below!
In case you want to see the video of the teardown, here you are satisfied:
Source
What is black and white cable running from top to bottom?
“Of smartphones”, for goodness, we say “of” and not “of smartphones”…
In fact you are right, I don't know where the "gods" came from. 😅
I think it's a great phone, but today that everyone aims to have an excellent photographic sector, they remove the optical stabilizer!