Xiaomi is preparing to enter the competitive world of semiconductors with its first proprietary System-on-a-Chip (SoC), called X-RING. This ambitious project, which sees the company collaborating with MediaTek, look at reduce Xiaomi's dependence on external suppliers and create a more integrated and optimized ecosystem for their devices.
Xiaomi XRING: Here is the new MediaTek-based processor
The introduction of the XRING is a pivotal moment for Xiaomi, which intends to follow in the footsteps of giants such as Apple, known for excellent synergy between hardware and software. By developing an in-house SoC, the company will be able to make the most of your internal resources, improving the performance and user experience of its products.
Thanks to leaks and discussions that have emerged on platforms like AOSP, we are able to outline some of the key specifications of Xiaomi's new chip. The Xiaomi XRING will adopt a triple-cluster configuration, similar to that of Google's Tensor G3:
- 1x Cortex-X3: High-performance core for more demanding tasks.
- 3x Cortex-A715: Balanced cores for a good compromise between power and energy consumption.
- 4x Cortex-A510: Efficient cores designed to reduce power consumption.
Xiaomi XRING will also be equipped with a ARM GPU Mali, known for its reliability in multimedia and gaming applications. This choice underlines Xiaomi's intention to use proven solutions to accelerate development.
As for connectivity, the chip will rely on a modem MediaTek, as well as ai forms WiFi e Bluetooth always supplied by the Taiwanese company. The use of MediaTek components will allow Xiaomi to reduce development time and costs, focusing instead on optimizing software integration.
Xiaomi will face fierce competition in the semiconductor industry, dominated by giants like Qualcomm and Apple. To stand out in this context, the Chinese company will be called upon to develop a SoC that not only matches, but surpass the solutions offered by rivals in terms of computing power, energy consumption and cutting-edge features.
