MediaTek, the popular mobile chip maker, today announced the launch of a new Dimension 6000 series chip, the Dimension 6100+. This chip is aimed at budget 5G terminals and offers several advanced features in terms of performance, connectivity, photography and display. MediaTek has said that the first smartphones and tablets equipped with the Dimension 6100+ chip will be available in the third quarter of 2023.
MediaTek Dimensity 6100+ is the new chip that brings high-end features to budget devices
The Dimension 6100+ chip is made with the 6 nm process and integrates an octa-core CPU composed of two Arm Cortex-A76 large cores and six Arm Cortex-A55 power efficiency cores.
The highlight of the Dimension 6100+ chip is its own 5G connectivity. The chip integrates a 5G modem that supports the 3GPP Release 16 standard, which offers higher speed, higher reliability and better security than the previous generation. The chip also supports 5G dual-carrier aggregation with a bandwidth of 140MHz, which can increase data rate and signal coverage. In addition, the chip supports MediaTek UltraSave 5+ 3.0G power-saving technology, which can reduce the power consumption of 20G communications by 5% and extend the battery life of 5G terminals.
As for photography, the Dimension 6100+ chip supports one 108 megapixel high definition main camera, which can capture detailed and lifelike images. The chip also supports 2K video recording at 30fps, which can offer smooth and clear video quality. In addition, the chip supports AI blur imaging and AI-Color technology co-developed with ArcSoft, which can enhance the visual effects of photos and videos.
As for the display, the Dimension 6100+ chip supports billion color displays, to offer a wider color gamut and greater color fidelity. The chip it also supports high refresh rate displays from 90Hz to 120Hz, which can offer more smoothness and responsiveness of the screen. In addition, the chip supports 10-bit images and videos.
