This morning the Chinese blogger “Fixed Focus Digital” published the first ones render of the alleged Redmi K70, which confirm the design of the camera module already anticipated by a sketch.
The Redmi K70 is shown in a render: three rear cameras and ultra-thin bezels
From what we see, the Redmi K70 will have three rear cameras arranged in a matrix, similar to the standard Mi 13 presented in late 2022. The main difference is that the Mi 13 has the “LEICA” logo in the lower right corner, while the Redmi K70 has a flash.
The Redmi K70 will also have a screen with very thin and uniform bezels on all four sides, which should ensure a great viewing experience. Of course, these renders may not accurately reflect the final product.
As for performance, according to rumors, the Redmi K70 will be equipped with the Snapdragon 8 Gen2, Qualcomm's flagship chip for 2023. This processor is built on TSMC's 4nm process and has a 1+4+3 architecture CPU. The most powerful core is a 3GHz Cortex X3,2, followed by 4 large cores (2 Cortex-A715 and 2 Cortex A710) at 2,8GHz and 3 small Cortex A510 cores at 2GHz. The Snapdragon 8 Gen2 also supports LPDDR5x memory at 4200 MHz and the UFS 4.0 standard.
The Snapdragon 8 Gen2 also stands out for its cognitive ISP, which allows you to automatically improve photos and videos thanks to real-time semantic segmentation. The ISP can recognize faces, facial features, hair, clothes, sky and other elements in the images and optimize them separately with artificial intelligence.
Il Redmi K70 Pro, on the other hand, will be even more powerful, thanks to the Snapdragon 8 Gen3, Qualcomm's next generation mobile platform. This chip is expected to have a 1+3+4 architecture CPU, with one 3 GHz Cortex X3,5 super large core, 3 GHz Cortex A715 large cores, and 3 4 GHz Cortex A510 small cores. The Snapdragon 2 Gen8 will support also LPDDR3x memory at 5 MHz and the UFS 4800 standard.
The two smartphones of the sub brand of Xiaomi should be presented by the end of the year.
