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LeTV S1 announced: the brand returns with a smartphone equipped with Unisoc Tanggula T740 chip

Today the first smartphone produced by LeTV was launched after several years of absence from the sector. The new smartphone is called LeTV S1 and will be available in China in the 8 GB + 256 GB version, priced at 1599 yuan, around 215 euros at the exchange rate.

LeTV S1 announced: the brand returns with a smartphone equipped with Unisoc Tanggula T740 chip

The LeTV S1 features a 6,53 inch water drop LCD screen with a resolution of 1600X720 and a body size of 163,6 x 75,5 x 9,7 mm.

In terms of base specs, the LeTV S1 is equipped with Unisoc Tanggula T740 chip with eight-core heterogeneous CPU architecture and ≥2,5 TOP / W power efficiency ratio. The chip supports SA / NSA dual module network, which covers the traditional 5G frequency band.

For photos we have a 48MP rear ultra-clear Samsung main camera, a macro photo camera and a depth of field sensor.

In terms of battery life, the built-in battery has a capacity of 4900 mAh, so even if used for a long time, there is no need to worry about the runtime.

Finally, it is worth mentioning that the LeTV S1 has a built-in Huawei account system, Huawei HMS Core, and a variety of Huawei applications such as music and reading.

On offer on Amazon

132,38€
available
21 used starting at € 132,38
as of May 1, 2024 9:25
Amazon.it
Last updated on May 1, 2024 9:25

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Pierpaolo Figuccia
Pierpaolo Figuccia

Nerd, passionate about technology, photography and video maker. And of course I love Xiaomi products!

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