Today the Taiwanese chip maker MediaTek has released a new generation of its mobile platform Dimensity 7050.
MediaTek Dimensity 7050 officially announced: entry-level chip with APU 3.0
The newly announced new chip is built on TSMC's 6nm manufacturing process. The CPU part consists of two large Cortex A78 cores running at a frequency of 2,6Ghz and six small Cortex A55 cores running at a frequency of 2,0Ghz. As GPU we have a Mali-G68 MC4, there is support for LPDDR5/4x RAM and UFS 3.1/2.1 internal storage.
Not only, the Dimension 7050 is also equipped with an APU 3.0. Thanks to the AI computing power of APU 3.0, the Dimensity 7050 supports hand recognition patterns such as sensing, tracking, skeleton, gesture, and verification.
At the same time, it also supports real-time calculation of 3D AI gesture tracking, including the detection of human gestures in space, multiple joints and hand degrees of freedom, position and rotation, and perform real-time rendering.
It has been reported that the Dimension 7050 will launch with the series Realm 11 which will be officially released on May 10th. According to the typical positioning of the Realme series, the 11 series will have a price of around 1000 yuan, about 130 euros at the exchange rate.
We recall that previously MediaTek announced it will officially introduce a new generation of the flagship 5G platform, the Dimension 9200+ on May 10th.
Be it GeekBench or AnTuTu, this flagship chip has the highest score, which also means that the Dimension 9200+ will become the Performance King for Android smartphones.
According to the previous leaks, the MediaTek 9200+ is expected to adopt TSMC's 4nm manufacturing process with the CPU part consisting of one Cortex X3 super core, three large Cortex A715 cores and four small Cortex A510 cores, of which the core frequency super large is 3,35 GHz and the large core has a frequency of 3,0 GHz. As for graphics, the GPU is an Immortalis-G715 MC11.
On offer on Amazon
