The launch of the Xiaomi Mi 5 he approaches more and more and waiting never seems to end. The presentation of the new Chinese flagship will be in China | Xiaomi Mi5 will be officially presented in 24 February | which al Mobile World Congress 2016 of Barcelona Xiaomi Mi 5 will also be present at the MWC 2016 in Barcelona |, officially confirmed by the vice president of the company, Hugo Barra.
We are currently aware of almost all of its features, from display resolution in Full-HD to the processor that will be mounted, the Snapdragon 820. We got to give a taste of his excellent photo quality, thanks to the shots of the president of the company, Lin Jun (visible here), and those of the vice-president, Hugo Barra (visible here), at full resolution. Finally, we also learned that he will have the support at Dual-SIM andNFC (see here).
Today we come to know from Xiaomi himself a new detail. In particular, an image was shown to the public in which the first is shown soft ultra-thin cover (0,45 mm) for the Xiaomi Mi 5.
What immediately jumps to the eye, is the position of the hole for the camera and LED flash (top left), as seen in some renderings of the smartphone. In addition, the lack of other holes in the back goes to support the voice of the possible front button with fingerprint detector. Not only that, this also indicates that the main speaker could be placed in the lower part of the device next to the USB port, like the Xiaomi Mi 4, and not on the back. And what do you think?
via | Xiaomi Fans Italia
