MediaTek, the well-known smartphone chip manufacturer, today announced the launch date of its new processor, the MediaTek Dimensity 8300. It is a 5G chip that promises to offer high performance and low power consumption.
The launch date of the new MediaTek Dimensity 8300 processor has been revealed
The MediaTek Dimensity 8300 will be presented in an online press conference at 15:00 pm (local time) on November 21st, with the presence of some of the company's most important partners, including Oppo, Living, Realm and Xiaomi. The processor has been defined as “Bingfeng Energy Efficiency, Super Evolution”, in reference to the Chinese name of the city of Shenzhen, where MediaTek's headquarters are located.
MediaTek's new chip will be the successor to the MediaTek Dimensity 8200, which was launched last December and had received excellent reviews from critics and consumers. The new chip should improve the performance and scalability of the previous one, thanks to a higher core frequency and better memory management.
According to the specifications revealed by Revengus, a former MediaTek employee who shared the information on social media, the MediaTek Dimensity 8300 will have an architectural configuration consisting of a 3 GHz Cortex X2.8 core, three 715 GHz Cortex A2.4 cores and four Cortex cores A715 at 1.6 GHz. The chip will also support the Cortex A510 core with the Mali G520 MC6 GPU at 850 MHz.
The Dimensity 8300 will feature an integrated modem that will support Uplink and Downlink bands up to 7.5 Gbps and up to 3 Gbps respectively. The chip will be able to support up to four rear cameras and up to two front cameras with a maximum resolution of 108 MP.
The “price” and launch date of the MediaTek Dimensity 8300 have not yet been officially announced by the company. However, it is estimated that the chip could be available on the market by the end of the year or early next year. The processor will therefore prove to be one of the most powerful and efficient on the smartphone market with 5G connectivity.
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