MediaTek churned out another processor, the Dimension 900 5G. It is a SoC intended for smartphones of high and medium-high end, built with a 6nm lithographic process. The commitment of the Taiwanese company, also faced with the problem of the chip crisis, is exemplified in the production of cheap but excellent performance. So let's go and see what awaits us in the next mid-high range devices of the future.
MediaTek presents Dimensity 900 5G, a thick processor for performing smartphones: 6nm and lots of power. Here are all the details
The key element of the SoC MediaTek Dimensity 900 5G is an eight-core processor consisting of two Arm cores Cortex-A78 with clock up to 2.4 GHz and six core Arm Cortex-A55 with clock up to 2 GHz. The memory controller supports type RAM L and type storage UFS 3.1. The SoC configuration also includes one Arm Mali-G68 MC4 GPU and a third-generation artificial intelligence processor, according to MediaTek, featuring extremely high energy efficiency and support for a wide range of AI applications.
The integrated 5G New Radio (NR) modem, which works up to 6 GHz, supports carrier aggregation and bandwidth up to 120 MHz. Integrated image signal processor MediaTek Imagiq 5.0 supports video recording HDR e 4K HDR with hardware acceleration. The MediaTek Dimensity 900 5G can support up to four cameras simultaneously and sensors with one resolution up to 108 megapixels.
According to the news reported in press conference, the first smartphones equipped with MediaTek Dimensity 900 5G are expected to appear during the this same quarter (from today until the end of June).
