Qualcomm, the world leader in the production of smartphone processors, could be working on a new chip belonging to the series Snapdragon 8 Gen. It would be a less performance and expensive version of its current top of the range, the Snapdragon 8 Gen3, presented last December.
Qualcomm working on a new Snapdragon 8 series chip, it will be a lite version of Gen 3
The new chip, which would have the code SM8635, was revealed by Digital Chat Station, a reliable source of leaks, on the Chinese social network Weibo. According to the leaked information, the chip would be equipped with a 4GHz ARM Cortex X2.9 core and an Adreno 735 GPU. Furthermore, it would get a score of over 1.7 million on AnTuTu, the popular benchmark for measuring the performance of mobile devices. This score would place it above the Snapdragon 8 Gen 2, the Snapdragon 8 Gen 3's predecessor, in terms of raw power.
However, the official name and position of the SM8635 chip within the Snapdragon lineup is still unclear. Roland Quandt, another well-known leaker, has in fact revealed that Qualcomm has two similar chips in development: the SM8635 and the SM7675. The latter would be it Snapdragon 7+ Gen3, the most powerful of the Snapdragon 7 series, intended for medium-high range smartphones.
Qualcomm has not yet confirmed or denied the existence of the SM8635 chip, but some smartphone models have already been associated with this processor. It's about the Poco F6, the successor to the popular Poco F5, of the Redmi Note 13 Turbo, the new mid-range from Xiaomi, and of a future iQOO Neo, the Vivo brand dedicated to gaming.
Qualcomm could then launch the SM8635 chip as one lite version of the Snapdragon 8 Gen 3, to offer producers and consumers a more economical but still high-performance solution.
For those who don't know, the Snapdragon 8 Gen series offers the best features in terms of connectivity, artificial intelligence, graphics and photography. The SM8635 chip could be a new addition to this family, to meet the needs of an increasingly demanding market.
