The rumors that preceded the advent of the new Qualcomm processor, the Snapdragon 845 have been confirmed by the fact that during theevent began yesterday 4 December with end the day 8 December, at the Hawaiian Islands, the US company will present to the insiders in new flagship chipset, which should be realized with a production process at 10 nm, offering a renewed Adreno GPU and better core performance.
The 845 Snapdragon CPU could see the light during the CES to be held in January 2018, but at present the rumors around the world see him hired under the hood of the future top of the range Samsung Galaxy S9, LG G7, Sony Xperia XZ2 but especially on the expected and already chatted Xiaomi Mi 7. And so it is no coincidence that the Chinese company CEO, Lei Jun, has been spotted at the airport in the Hawaiian Islands waiting for the shuttle bus to the Qualcomm conference about the Snapdragon 845.
All this therefore seems to confirm the rumors and the hopes that they want a performance Xiaomi Mi 7 thanks to the new CPU SD845 that will bring interesting news in terms of performance and various optimizations thanks to the new Adreno 630 GPU and the possibility of speed in download up to 1,2 GBps. The hope is also that there is not an exclusive for Samsung, as was the previous Snapdragon 835, considering Xiaomi for the 800 series in general accounted for 66% of Qualcomm shipments in China.
