On February 18, Redmi launched the new K50 Gaming Edition which in just 1 minute obtained revenues of over 280 million yuan (39 million euros). Today, however, the official profile of Redmi has published a video of the device's teardown; let's go and watch it together!
Redmi K50 Gaming Edition stripped in the first official video teardown
As we see in the video, after opening the back cover, it is possible to observe the internal arrangement of the components. After further disassembly, you can see the heat dissipation system composed of graphene heat dissipation film material, high power 3D graphite, large area double VC and boron nitride heat dissipation copper sheet.
At the presentation it was reported that the e-sport version of the K50 has 7 major innovations and 5 new materials important for heat dissipation, in particular the separation layout of the processor heat source and the charging heat source. Additionally, the core heat dissipation material may be the largest in the industry at 4860 square millimeters.
Specifically, the main VC area is 4015 square millimeters, covering the top half of the processor and the battery. The secondary VC area is 845 square millimeters, and covers two charging IC chips, with a 3D step structure that fits perfectly without leaving gaps. At the same time, there is a large area of graphene on the front that connects the double VC, and the back is high-power 3D graphite, which improves the thermal conductivity by 15%.
We then observe the disassembly of the various components including the rear cameras, the motherboard with the Snapdragon 8 Gen 1 chipset on board, LPDDR5 RAM and UFS 3.1 internal memory, JBL speakers, CyberEngineX vibration module and finally the 4700mAh dual cell battery with support for 120W charging.
