While in these hours the Xiaomi Mi 5S open sales in China began, the site IT168 has already made a device teardown by revealing everything that was to be revealed and clarifying some doubts left behind after the presentation that was quite summary.
The Xiaomi Mi 5S has undeniably brought some really interesting technical solutions that have never been seen on any phone yet. We are obviously talking about the ultrasonic fingerprint sensor applied to the glass of the phone. Even the 3D touch is to be considered a discreet novelty. All seasoned with a powerful SnapDragon 821 SoC… at an incredible $ 300
The disassembly operation was carried out on the "superior" model with 4gb of RAM and 128gb ROM. Professional tools were used in the hands of equally professional operators. I strongly advise you not to personally try such a teardown even if according to the technicians, the assembly / disassembly is rather easier than other phones. Do not try this at home!
Only 2 screws separate us from the stripping of the phone, removed these, the backcover is easily removed and allows access to the components. In plain sight we immediately find the 3200mAh battery, the 4GB RAM module produced by SK Hynix, the 378-inch Sony IMX2.3 photo sensor.
In order to keep the size (and cost?) Reduced, compared to Mi5, the infrared sensor and optical stabilizer have been removed. We wait for some field test to understand how this will affect.
Good teardown!
