As we saw yesterday just in a benchmarking carried out by our Alexander who in this period is testing the Xiaomi Mi 9 for the future review, the latest flagship of the Chinese giant is the most powerful smartphone currently on the market with a score of over 360 thousand points on AnTuTu.
Well, paraphrasing the sentence said by Uncle Ben to Peter Parker, we could say that "from a great power comes great responsibility". In this case with responsibility we mean a cooling system that is able to keep the Xiaomi Mi 9 cool even under stress. Apparently we shouldn't worry though, as Xiaomi's product director, Want Teng, assured us that the smartphone has been equipped with all the necessary hardware to avoid overheating and has also gone into details, which he divided into five main points.
Xiaomi Mi 9: The cooling system in detail
First point
The Xiaomi Mi 9 adopts a central aluminum structure machined with CNC process. It therefore has a high thermal conductivity better than about 200% compared to the ordinary one created with die-cast aluminum.
Second Point
Inside the smartphone we find a sheet of graphite with the same area of the screen on the metal frame, the material has a thermal conductivity 6-8 times greater than that of aluminum. This obviously implies a greater heat dissipation capacity.
Third point
To obtain the same temperature even on the back of the device, a small piece of graphite is fixed to the antenna support. This small sheet of graphite is not visible on the transparent plate because a thermally conductive material is then added to ensure heat dissipation and a more pleasant visual effect.
Fourth point
The Mi 9 has a very innovative heatsink design that is even within the antenna bracket. Here, a large sheet of graphite is used, extending from the top to the wireless charging coil, thus ensuring that during game sessions, heat can be effectively spread throughout the area from the motherboard up to the coil. Vice versa, when using wireless charging, the heat created is diffused from the coil to the motherboard surface, ensuring a faster cooling for each type of use.
5th point
The team that worked on the Xiaomi Mi 9 cooling system has also invested time and resources on other details that are difficult to see with the naked eye. For example, to make the temperature of the front and back surfaces more uniform and maximize the heat dissipation capacity, Xiaomi has filled with a thermal protection gel both the space between the heat sink and the central frame where the CPU sits. between the frame and the CPU itself. There is also a piece of copper foil applied between the CPU heatsink surface and the high thermal conducting aluminum material of the central frame. While to keep the device cool when charging to 27W both the surface of the charging chip and that of the heatsink are used.
Finally, as if that were not enough, Xiaomi has also added a graphite sheet on the speaker in order to dissipate that poco heat produced by the speaker.
In conclusion, we can say that it is difficult to understand if Xiaomi has taken particular measures to avoid overheating or if it uses the typical dissipation system already seen on other flagships on the market. But what we can confirm is that the Xiaomi Mi 9 does not seem to have any problem of overheating documented until today and we hope that it will continue in the future. We also remember that the new Qualcomm Snapdragon 855 processor uses a production process at 7nm and therefore already heats up less than last year's Snapdragon 845.
